According to the latest content of the “World Fab Forecast” published by SEMI (International Semiconductor Industry Association) on February 28, 2018, the global fab equipment spending in 2019 will increase by 5% Four years of significant growth (as shown).


Global Wafer Equipment Expenditure Creates Fourth-Year Record Growth Record
Unless the original plan is substantially changed, mainland China will be the main driver for the growth of equipment spending for global fabs in 2018 and 2019. The global fab investment situation is strong. Since the mid-1990s, the industry has never had a record of three-year growth in equipment spending.
SEMI predicts that Samsung's ranking will be the highest among fabs in 2018 and 2019. However, the investment amount is not as high as 2017. In contrast, in order to support multinational and local fab projects, the spending on fab equipment in mainland China in 2018 will increase by 57% from the previous year, and by 60% in 2019. The amount of equipment spending in mainland China is expected to surpass South Korea by 2019 and become the highest spending area in the world.
Following the record amount of investment in 2017, Korean fab equipment spending will decline by 9% to 18 billion U.S. dollars by 2018, and will drop by 14% to 16 billion U.S. dollars in 2019, but spending in both years will exceed 2017. Before the year level. Regarding Taiwan, which has the world’s third-largest wafer fab investment, wafer equipment spending will decline by 10% in 2018 to approximately US$10 billion, but it is expected to rebound by 15% in 2019 to more than US$11 billion.
As previously expected, as the previously built fabs entered the equipment-installation phase, the spending on fab equipment in mainland China continued to increase. In 2017, 26 wafer factories in China started to set a new record. Equipment will be installed in the next two years.
All equipment investment in wafer factories in China is still dominated by foreign investment. However, local companies are expected to increase wafer fab investment in 2019, and their share of all relevant spending in Mainland China will increase from 33% in 2017 to 45% in 2019.
Product category expenditure
3D NAND will be the most expensive product category. It will grow by 3% each in 2018 and 2019, and the amounts will reach 16 billion U.S. dollars and 17 billion U.S. dollars respectively. In 2018, DRAM will grow by 26% to 14 billion U.S. dollars, but in 2019 it will drop 14% to 12 billion U.S. dollars. In order to support 7nm process-related investments and increase new production capacity, wafer-generation industrial equipment spending will increase by 2% to $17 billion in 2018. It is estimated that after entering 5nm next year, it will increase by as much as 26% to reach $22 billion.